Seven evergreen articles on how boards are designed, quoted, built and inspected. None of them report a company event — they explain the engineering behind the price.
Every article below is a working note rather than a report. Filter by category, or read the full text.
Extra layers change the build route, not just the material bill: lamination cycles, thicker plating, longer drilling and test time, and a yield curve that steepens with every added layer. Here is where the money actually goes.
As BGA pitch falls, the board stops being a flat electrical artefact and becomes a thermal and warpage problem. Heat paths, Z-axis expansion, reflow stiffness and assembly keep-outs all move with the stack-up.
Gerbers, a stack-up, or just the question you are stuck on. We answer inquiries during Monday to Saturday, 9:00–18:30 (GMT+8).
